GMM-U1 Datasheet, PDF (29/36 Pages) List of Unclassifed Manufacturers – GPS Module

GlobalTop Technology
Gmm-u1 Data Sheet
29 _{Ver. V0G}
5.3 Storage and Floor Life Guideline
Since GlobalTop modules must undergo solder-reflow process in 72 hours after it has gone
through pre-baking procedure, therefore if it is not used by then, it is recommended to store
the GPS modules in dry places such as dry cabinet.
The approximate shelf life for GlobalTop GPS modules packages is 6 months from the bag
seal date, when store in a non-condensing storage environment (<30°C/60% RH)
It is important to note that it is a required process for GlobalTop GPS modules to
undergo pre-baking procedures, regardless of the storage condition.
5.4 Drying
Because the vapor pressures of moisture inside the GPS modules increase greatly when it is
exposed to high temperature of solder reflow, in order to prevent internal delaminating,
cracking of the devices, or the “popcorn” phenomenon, it is a necessary requirement for
GlobalTop GPS module to undergo pre-baking procedure before any high temperature or
solder reflow process.
The recommendation baking time for GlobalTop GPS module is as follows:
60°C for 8 to 12 hours
Once baked, the module’s floor life will be “reset”, and has additional 72 hours in normal
factory condition to undergo solder reflow process.
Please limit the number of times the GPS modules undergoes baking processes
as repeated baking process has an effect of reducing the wetting effectiveness
of the SMD pad contacts. This applies to all SMT devices.
Oxidation Risk: Baking SMD packages may cause oxidation and/or intermetallic
growth of the terminations, which if excessive can result in solderability
problems during board assembly. The temperature and time for baking SMD
packages are therefore limited by solderability considerations. The cumulative
bake time at a temperature greater than 90°C and up to 125°C shall not exceed
96 hours. Bake temperatures higher than 125°C are n ow allowed.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2011 GlobalTop Technology Inc. All Rights Reserved.