GMM-U1 Datasheet, PDF (26/36 Pages) List of Unclassifed Manufacturers – GPS Module

GlobalTop Technology
Gmm-u1 Data Sheet
26 _{Ver. V0G}
5. Packing and Handling
GPS modules, like any other SMD devices, are sensitive to moisture, electrostatic discharge,
and temperature. By following the standards outlined in this document for GlobalTop GPS
module storage and handling, it is possible to reduce the chances of them being damaged
during production set-up. This document will go through the basics on how GlobalTop
packages its modules to ensure they arrive at their destination without any damages and
deterioration to performance quality, as well as some cautionary notes before going through
the surface mount process.
Please read the sections II to V carefully to avoid damages permanent damages
due to moisture intake
GPS receiver modules contain highly sensitive electronic circuits and are
electronic sensitive devices and improper handling without ESD protections
may lead to permanent damages to the modules. Please read section VI for more
details.
5.1 Moisture Sensitivity
GlobalTop GPS modules are moisture sensitive, and must be pre-baked before going
through the solder reflow process. It is important to know that:
GlobalTop GPS modules must complete solder reflow process in 72 hours after pre-
baking.
This maximum time is otherwise known as “Floor Life”
If the waiting time has exceeded 72 hours, it is possible for the module to suffer damages
during the solder reflow process such as cracks and delamination of the SMD pads due to
excess moisture pressure.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2011 GlobalTop Technology Inc. All Rights Reserved.