GMM-U1 Datasheet, PDF (31/36 Pages) List of Unclassifed Manufacturers – GPS Module

GlobalTop Technology
Gmm-u1 Data Sheet
31 _{Ver. V0G}
6. Reflow Soldering Temperature Profile
The following reflow temperature profile was evaluated by GlobalTop and has been proven
to be reliable qualitatively. Please contact us beforehand if you plan to solder this component
using a deviated temperature profile as it may cause significant damage to our module and
your device.
All the information in this sheet can only be used only for Pb-free manufacturing process.
6.1 SMT Reflow Soldering Temperature Profile
(Reference Only)
Average ramp-up rate (25 ~ 150°C): 3°C/sec. max.
Average ramp-up rate (270°C to peak): 3°C/sec. max.
Preheat: 175 ± 25°C, 60 ~ 120 seconds
Temperature maintained above 217°C: 60~150 seconds
Peak temperature: 250 +0/-5°C, 20~40 seconds
Ramp-down rate: 6°C/sec. max.
Time 25°C to peak temperature: 8 minutes max.
°C
217°C
Peak:250+0/-5°C
Slop:3°C /sec. max.
(217°C to peak)
Slop:6°C /sec. max.
Preheat: 175±5°C
20 ~ 40 sec.
60 ~120 sec.
Slop:3°C /sec. max.
25°C
60 ~150 sec.
Time (sec)
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2011 GlobalTop Technology Inc. All Rights Reserved.