GMM-U1 Datasheet, PDF (34/36 Pages) List of Unclassifed Manufacturers – GPS Module

GlobalTop Technology
Gmm-u1 Data Sheet
34 _{Ver. V0G}
Other Cautionary Notes on Reflow-Soldering Process:
1. Module must be pre-baked before going through SMT solder reflow process.
2. The usage of solder paste should follow “first in first out” principle. Opened solder
paste needs to be monitored and recorded in a timely fashion (can refer to IPQC for
related documentation and examples).
3. Temperature and humidity must be controlled in SMT production line and storage
area. Temperature of 23°C, 60±5% RH humidity is rec ommended. (please refer to
IPQC for related documentation and examples)
4. When performing solder paste printing, please notice if the amount of solder paste is
in excess or insufficient, as both conditions may lead to defects such as electrical
shortage, empty solder and etc.
5. Make sure the vacuum mouthpiece is able to bear the weight of the GPS module to
prevent positional shift during the loading process.
6. Before the PCBA is going through the reflow-soldering process, the operators should
check by eyesight to see if there are positional offset to the module.
7. The reflow temperature and its profile data must be measured before the SMT
process and match the levels and guidelines set by IPQC.
8. If SMT protection line is running a double-sided process for PCBA, please process
GPS module during the second pass only to avoid repeated reflow exposures of the
GPS module. Please contact GlobalTop beforehand if you must process GPS
module during the 1^st pass of double-side process.
Figure 6.2: Place GPS module right-side up when running reflow-solder process, do not
invert.
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