GMM-U1 Datasheet, PDF (32/36 Pages) List of Unclassifed Manufacturers – GPS Module

GlobalTop Technology
Gmm-u1 Data Sheet
32 _{Ver. V0G}
6.2 Cautions on Reflow Soldering Process
Details
1 Before proceeding with the reflow-
soldering process, the GPS module
must be pre-baked.
Suggestions
Notes
Pre-bake Time:
6 Hours @ 60°±5°C or
4 Hours @ 70°±5°C
The maximum tolerated
temperature for the tray is
100°C.
After the pre-baking
process, please make sure
the temperature is
sufficiently cooled down to
35°C or below in order to
prevent any tray
deformation.
2 Because PCBA (along with the patch The parameters of the Double check to see if the
antenna) is highly endothermic during reflow temperature
surrounding components
the reflow-soldering process, extra
must be set
around the GPS module are
care must be paid to the GPS
accordingly to
displaying symptoms of
module's solder joint to see if there module’s reflow-
cold weld(ing) or false
are any signs of cold weld(ing) or
soldering temperature welding.
false welding.
profile.
3 Special attentions are needed for
A loading carrier
PCBA board during reflow-soldering fixture must be used
to see if there are any symptoms of with PCBA if the
bending or deformation to the PCBA reflow soldering
board, possibility due to the weight of process is using rail
the module. If so, this will cause
conveyors for the
concerns at the latter half of the
production.
production process.
If there is any bending or
deformation to the PCBA
board, this might causes the
PCBA to collide into one
another during the
unloading process.
4 Before the PCBA is going through the The operators must If the operator is planning to
reflow-soldering process, the
check by eyesight and readjust the module
production operators must check by readjust the position position, please do not
eyesight to see if there are positional before reflow-
touch the patch antenna
offset to the module, because it will be soldering process.
while the module is hot in
difficult to readjust after the module
order to prevent rotational
has gone through reflow-soldering
offset between the patch
process.
antenna and module
Note: References to patch antenna is referred to GPS modules with integrated Patch-on-top
antennas (PA/Gms Module Series), and may not be applicable to all GPS modules.
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