GS82032T Datasheet, PDF (21/23 Pages) List of Unclassifed Manufacturers – 64K x 32 2M Synchronous Burst SRAM

TQFP and QFP Package Drawing
θ
L
L1
c
Preliminary
GS82032T/Q-150/138/133/117/100/66
e
b
A1
A2
E1
E
TQFP
Symbol Description Min. Nom. Max
A1
Standoff
0.05 0.10 0.15
A2
Body Thickness 1.35 1.40 1.45
b
Lead Width
0.20 0.30 0.40
c
Lead Thickness 0.09 — 0.20
D
Terminal Dimension 21.9 22.0 22.1
D1
Package Body
19.9 20.0 20.1
E
Terminal Dimension 15.9 16.0 16.1
E1
Package Body
13.9 14.0 14.1
e
Lead Pitch
— 0.65 —
L
Foot Length
0.45 0.60 0.75
L1
Lead Length
— 1.00
Y
Coplanarity
—
— 0.10
θ
Lead Angle
0°
—
7°
Notes:
1. All dimensions are in millimeters (mm).
2. Package width and length do not include mold protrusion
Min.
0.25
2.55
0.20
0.10
22.95
19.9
17.0
13.9
—
.60
—
—
0°
QFP
Nom.
0.35
2.72
0.30
0.15
23.2
20.0
17.2
14.0
0.65
0.80
1.60
—
—
Max
0.45
2.90
0.40
0.20
23.45
20.1
17.4
14.1
—
1.00
—
0.10
7°
Rev: 1.04 2/2001
21/23
© 2000, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.