EN29GL064_11 Datasheet, PDF(64/64 Page) Eon Silicon Solution Inc. – 64 Megabit (8192K x 8-bit / 4096K x 16-bit) Flash Memory Page mode Flash Memory, CMOS 3.0 Volt-only

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EN29GL064_11 Datasheet, PDF (64/64 Pages) Eon Silicon Solution Inc. – 64 Megabit (8192K x 8-bit / 4096K x 16-bit) Flash Memory Page mode Flash Memory, CMOS 3.0 Volt-only

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Revisions List

EN29GL064

Revision No

Description

Date

Preliminary

2009/03/20

1. Add internal pull-up description for WP# pin in Table1 in Page 4

2. Add WP#/ACC, VIO pin in Figure3 in Page 4

3. Modify tOE from 30ns to 25ns in Table 17 in page 40 and Page 5

4. Add Secured Silicon Sector Entry/Exit command in Table13

5. Modify typo from Sector Erase Suspend to Erase/Program Suspend,

from Sector Erase Resume to Erase/Program resume in Table13

6. Del table 22 and Figure 20 Temporary Sector Unprotect Timing table and

Diagram and Figure 21.Sector Protect/Unprotect Timing Diagram

7. Add ACC and total write buffer time spec in Table 22.

8. Modify DC Characteristics in table 15

2009/05/12

VHH from 10.5~11.5V to 8.5~9.5V

ICC1 5MHz 20Ã15mA typ, 10MHz 30Ã25mA typ

ICC4, ICC5 and ICC6 1Ã1.5uA typ, 5Ã10uA max

Add IIO2 and IACCspec

9. Del apply VID on address pin A9 to access autoselect codes function.

( Remove TABLE 5 and modify description Autoselect section for using

High voltage to get Autoselect Codes )

10. Modify A9 spec from 9.5V to Vcc+0.5V in ABSOLUTE MAXIMUM

RATINGS

1. Modify naming for DQ0 OTP Lock Bit to Secured Silicon Sector

Protection Bit in Page 33

2. Modify Table.8 Secured Silicon Sector Address Range 000000h-

000007h from Determined by customer to Reserve for Factory

3. Add note âThe address 0h~7h in Secured Silicon Sector is reserved

for Factoryâ in Page 39

4. Update FIGURE 24. 64 ball Fortified Ball Grid Array (FBGA), 11 X13

2009/7/14

mm, Pitch 1mm package outline in page 61

5. Modify from Sector 0 to all sectors in note 1 of Table 6 and note 2, 3 and

note 9 of PPB section in page 33

6. Add âUser only can use DQ6 and RY/BY# pin to detect programming

statusâ in note 10 in page 33

1. Add the 48-Ball (TFBGA) package information in page 1, 3, 61 and 64.

2. Correct the Persistent Protection Bits status in page 31, 32 and 33.

(1) Top boot: Sector 0~123 are 1 PPB per 4 sectors, Sector

124~134 have PPB for each boot sector.

2009/07/22

(2) Bottom boot: Sector 0~10 have PPB for each boot sector,

Sector 11~134 are 1 PPB per 4 sectors

3. Change the package code of 64-ball BGA in page 64.

Add the valid combinations of EN29GL064 on page 64

2009/09/07

Add a note "when sector SA0

Sector mode,..." on page 38.

suspended,

system

enters

Secured 2009/11/02

Add Write Buffer byte mode command

for word and byte mode in page 43

and

note

that

maximum

value

2010/03/15

Correct the

page 64.

typo

for

The

valid

combinations

EN29GL064

table

2010/04/06

1. Remove 48-pin TSOP package type information on page 1, 2, 59

and 64.

2. Remove 48-ball TFBGA package type information on page 1, 3,

2010/04/28

61 and 64.

1. Update Table 15. DC Characteristics on page 44.

(1) Icc3 from 30mA to 40mA. (max.)

(2) Icc4, Icc5, Icc6 from 1.5/10uA to 2.0/20uA (typ./max.)

2010/05/11

2. Update Chip Erase time from 140s to 60s (max.) on page 57.

1. Add ERRATA SHEET on page 63

2010/06/09

Remove VIO function.

2011/01/28

Revive VIO function.

2011/04/13

This Data Sheet may be revised by subsequent versions

or modifications due to changes in technical specifications.

Rev. M, Issue Date: 2011/04/13