EDX5116ACSE Datasheet, PDF (60/78 Pages) Elpida Memory – 512M bits XDR™ DRAM

EDX5116ACSE
Table 13 Timing Conditions (Continued)
Symbol
Parameter and Other Conditions
Minimum
Maximum
Units
Figure(s)
t_CMD-PDN
Last command before PDN entry
16
-
t_CYCLE
Figure 36
t_PDN-CFM
RSL CFM/CFMN and VTERM stable after PDN entry
16
-
t_CYCLE
Figure 36
t_CFM-PDN
t_PDN-CMD
RSL CFM/CFMN and VTERM stable before PDN exit
First command after PDN exit (includes lock time for CFM/CFMN)
16
-
4096
-
t_CYCLE
t_CYCLE
Figure 36
Figure 36
E^{Operating Characteristics} _{Electrical Characteristics}
Table 14 summarizes all electrical parameters (temperature,
current, and voltage) that characterize this memory compo-
O _{nent. The only exception is the supply current values (IDD)}
under different operating conditions covered in the Supply Cur-
rent Profile section.
L ^{The first section of parameters is concerned with the thermal}
The second section of parameters is concerned with the cur-
rent needed by the RQ pins and VREF pin.
The third section of parameters is concerned with the current
needed by the DQ pins and voltage levels produced by the DQ
pins when driving read data. This section is also concerned
with the current needed by the VTERM pin, and with the
resistance levels produced for the internal termination compo-
nents that attach to the DQ pins.
The fourth section of parameters determines the output volt-
age levels and the current needed for the serial interface signals.
characteristics of the memory component.
Table 14 Electrical Characteristics
Symbol
Parameter
Minimum
P ^ΘJC
Junction-to-case thermal resistance^a
-
I_I,RSL
RSL RQ or Serial Interface input current @ (V_IN=V_IH,RQ,MAX)
-10
I_REF,RSL
V_REF,RSL current @ V_REF,RSL,MAX flowing into VREF pin
-10
r _VOSW,DQ
DRSL DQ outputs - high-low swing:
V_OSW,DQ = (V_IH,DQ-V_IL,DQN) or (V_IH,DQN-V_IL,DQ)
0.200
o _RTERM,DQ
DRSL DQ outputs - termination resistance
40.0
V_OL,SI
RSL serial interface SDO output - low voltage
0.0
V_OH,SI
RSL serial interface SDO output - high voltage
V_TERM,RSL - 0.250
duct _{a. The package is mounted on a thermal test board which is defined JEDEC Standard JESD 51-9.}
Maximum
0.5
10
10
0.400
60.0
0.250
V_TERM,RSL
Units
°C/Watt
µA
µA
V
Ω
V
V
Preliminary Data Sheet E0881E20 (Ver. 2.0)
60