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GP1600FSM12 Datasheet, PDF (9/10 Pages) Dynex Semiconductor – Single Switch IGBT Module Advance Information | |||
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GP1600FSM12
PACKAGE DETAILS
For further package information, please contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
62
62
15 15
5
6
Aux C
E1
C1
Aux E
G
E2
C2
14.5 11
35
6x M4
20
4x M8
6x Ã7
5
140
Main Terminal screw plastic hole depth (M8) = 16.8 ± 0.3
Auxiliary and Gate pin plastic hole depth (M4) = 9± 0.3
Copper terminal thickness, Main Terminal pins = 1.5 ± 0.1
Copper terminal thickness, Auxiliary and Gate pin = 0.9 ± 0.1
Nominal weight: 1050g
Module outline type code: F
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
9/10
www.dynexsemi.com
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