DS80C320 Datasheet, PDF (21/42 Pages) Dallas Semiconductor – High-Speed/Low-Power Micro

DS80C320/DS80C323
NOTES FOR DS80C320 DC ELECTRICAL CHARACTERISTICS:
All parameters apply to both commercial and industrial temperature operation unless otherwise noted.
1. All voltages are referenced to ground.
2. Active current is measured with a 25 MHz clock source driving XTAL1, V_CC=RST=5.5V, all other
pins disconnected.
3. Idle mode current is measured with a 25 MHz clock source driving XTAL1, V_CC=5.5V, RST at
ground, all other pins disconnected.
4. Stop mode current measured with XTAL1 and RST grounded, V_CC=5.5V, all other pins disconnected.
when addressing external memory.
5. When addressing external memory.
6. RST=V_CC. This condition mimics operation of pins in I/O mode.
7. During a 0 to 1 transition, a one-shot drives the ports hard for two clock cycles. This measurement
reflects port in transition mode.
8. Ports 1, 2, and 3 source transition current when being pulled down externally. It reaches its maximum
at approximately 2V.
9. 0.45<V_IN<V_CC. Not a high impedance input. This port is a weak address holding latch because Port 0
is dedicated as an address bus on the DS80C320. Peak current occurs near the input transition point of
the latch, approximately 2V.
10. Over the industrial temperature range, this specification has a maximum value of 200 µA.
11. This is the current required from an external circuit to hold a logic low level on an I/O pin while the
corresponding port latch bit is set to 1. This is only the current required to hold the low level;
transitions from 1 to 0 on an I/O pin will also have to overcome the transition current.
12. Device operating range is 4.5V to 5.5V; however, device is tested to 4.0V to ensure proper operation
at minimum V_RST .
21 of 42