MTB60N06L3 Datasheet, PDF (9/9 Pages) Cystech Electonics Corp. – N -Channel Enhancement Mode Power MOSFET

CYStech Electronics Corp.
SOT-223 Dimension
Spec. No. : C708L3
Issued Date : 2009.05.26
Revised Date : 2013.10.30
Page No. : 9/8
A
Marking:
B
1
C
2
3
Device Name
Date Code
D
E
F
G
H
a1
Style: Pin 1.Gate 2.Drain 3.Source
I
3-Lead SOT-223 Plastic
Surface Mounted Package
a2
CYStek Package Code: L3
DIM
Inches
Min.
Max.
A 0.1142 0.1220
B 0.2638 0.2874
C 0.1299 0.1457
D 0.0236 0.0315
E *0.0906
-
F 0.2480 0.2638
Millimeters
Min.
Max.
2.90
3.10
6.70
7.30
3.30
3.70
0.60
0.80
*2.30
-
6.30
6.70
DIM
Inches
Min.
Max.
G 0.0551 0.0709
H 0.0098 0.0138
I
0.0008 0.0039
a1
*13^o
-
a2
0^o
10 ^o
*: Typical
Millimeters
Min.
Max.
1.40
1.80
0.25
0.35
0.02
*13^o
0.10
-
0^o
10 ^o
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTB60N06L3
Preliminary
CYStek Product Specification