MTB9D0P03H8 Datasheet, PDF (11/11 Pages) Cystech Electonics Corp. – P-Channel Enhancement Mode Power MOSFET

CYStech Electronics Corp.
DFN5×6 Dimension
Spec. No. : C050H8
Issued Date : 2017.04.05
Revised Date : 2017.04.10
Page No. : 11/11
Marking :
Device
Name
Date Code
B9D0
P03
8-Lead DFN5×6 Plastic Package
CYS Package Code : H8
Millimeters
DIM Min.
Max.
Inches
Min.
Max.
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
A
0.900 1.000 0.035 0.039
k
1.190 1.390 0.047 0.055
A3
0.254 REF
0.010 REF
b
0.350 0.450 0.014 0.018
D
4.944 5.096 0.195 0.201
e
1.270 TYP.
0.050 TYP.
E
5.974 6.126 0.235 0.241
L
0.559 0.711 0.022 0.028
D1 3.910 4.110 0.154 0.162 L1 0.424 0.576 0.017 0.023
E1
3.375 3.575 0.133 0.141
H
0.574 0.726 0.023 0.029
D2 4.824 4.976 0.190 0.196
θ
10°
12°
10°
12°
E2 5.674 5.826 0.223 0.229
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTB9D0P03H8
CYStek Product Specification