CY8C28243_09 Datasheet, PDF (60/65 Pages) Cypress Semiconductor – PSoC Programmable System-on-Chip

PRELIMINARY
Thermal Impedances
Table 47. Thermal Impedances per Package
Package
20 SSOP
28 SSOP
44 TQFP
48 QFN
56 SSOP
Typical θ_JA ^[29]
80.8 °C/W
45.4 °C/W
24.0 °C/W
16.7 °C/W
67.5 °C/W
Capacitance on Crystal Pins
Table 48. Typical Package Capacitance on Crystal Pins
Package
20 SSOP
28 SSOP
44 TQFP
48 QFN
56 SSOP
Package Capacitance
Pin9 = 0.0056 pF
Pin11 = 0.006048 pF
Pin13 = 0.006796 pF
Pin15 = 0.006755 pF
Pin16 = 0.009428 pF
Pin18 = 0.008635 pF
Pin17 = 0.008493 pF
Pin19 = 0.008742 pF
Pin27 = 0.007916 pF
Pin31 = 0.007132 pF
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 49. Solder Reflow Peak Temperature
Package
Minimum Peak Temperature^[30] Maximum Peak Temperature
20 SSOP
28 SSOP
44 TQFP
48 QFN
56 SSOP
245 °C
245 °C
245 °C
245 °C
245 °C
260 °C
260 °C
260 °C
260 °C
260 °C
CY8C28xxx
Notes
29.
30.
T_J = T_A + POWER x
Higher temperatures
θ_JA
may
be
required
based
on
the
solder
melting
point.
Typical
temperatures
for
solder
are
220
±
5^oC
with
Sn-Pb
or
245
±
5^oC
with
Sn-Ag-Cu
paste.
Refer to the solder manufacturer specifications.
Document Number: 001-48111 Rev. *D
Page 60 of 65
[+] Feedback