MB39C015 Datasheet, PDF (41/43 Pages) Cypress Semiconductor – High efficiency : 96% (Max)

18. Package Dimension
24-pin plastic QFN
(LCC-24P-M10)
24-pin plastic QFN
(LCC-24P-M10)
4.00±0.10
(.157±.004)
MB39C015
Lead pitch
Package width ×
package length
Sealing method
Mounting height
Weight
0.50 mm
4.00 mm × 4.00 mm
Plastic mold
0.80 mm Max
0.04 g
2.60±0.10
(.102±.004)
INDEX AREA
4.00±0.10
(.157±.004)
2.60±0.10
(.102±.004)
0.25±0.05
(.010±.002)
0.02
+0.03
–0.02
(.001
) ^+.001
–.001
0.75±0.05
(.030±.002)
(0.20(.008))
C _{2009-2010 FUJITSU SEMICONDUCTOR LIMITED C24060S-c-1-2}
0.50(.020)
TYP
0.40±0.05
(.016±.002)
1PIN CORNER
(C0.35(C.014))
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Document Number: 002-08364 Rev. *A
Page 41 of 43