4000S Datasheet, PDF (27/35 Pages) Cypress Semiconductor – 32-bit MCU Subsystem

PSoC^® 4: PSoC 4000S
Family Datasheet
Packaging
The PSoC 4000S will be offered in 48-pin TQFP, 40-pin QFN, 32-pin QFN, 24-pin QFN, and 25-ball WLCSP packages.
Package dimensions and Cypress drawing numbers are in the following table.
Table 36. Package List
Spec ID#
BID20
BID27
BID34A
BID34
BID34F
Package
48-pin TQFP
40-pin QFN
32-pin QFN
24-pin QFN
25-ball WLCSP
Description
7 × 7 × 1.4 mm height with 0.5-mm pitch
51-85135
6 × 6 × 0.6 mm height with 0.5-mm pitch
001-80659
5 × 5 × 0.6 mm height with 0.5-mm pitch
001-42168
4 × 4 × 0.6 mm height with 0.5-mm pitch
001-13937
2.02 × 1.93 × 0.48 mm height with 0.35-mm pitch 002-09957
Package Dwg
Table 37. Package Thermal Characteristics
Parameter
TA
TJ
TJA
TJC
TJA
TJC
TJA
TJC
TJA
TJC
TJA
TJC
Description
Operating ambient temperature
Operating junction temperature
Package θ_JA
Package θ_JC
Package θ_JA
Package θ_JC
Package θ_JA
Package θ_JC
Package θ_JA
Package θ_JC
Package θ_JA
Package θ_JC
Package
48-pin TQFP
48-pin TQFP
40-pin QFN
40-pin QFN
32-pin QFN
32-pin QFN
24-pin QFN
24-pin QFN
25-ball WLCSP
25-ball WLCSP
Min Typ Max
–40
25
85
–40
–
100
–
73.5
–
–
33.5
–
–
17.8
–
–
2.8
–
–
20.8
–
–
5.9
–
–
21.7
–
–
5.6
–
–
54.6
–
–
0.5
–
Table 38. Solder Reflow Peak Temperature
Package
All
Maximum Peak
Temperature
260 °C
Maximum Time at Peak Temperature
30 seconds
Table 39. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-020
Package
All except WLCSP
25-ball WLCSP
MSL
MSL 3
MSL 1
Units
°C
°C
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
Document Number: 002-00123 Rev. *I
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