EP7309 Datasheet, PDF (10/46 Pages) Cirrus Logic – HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE

EP7309
High-Performance, Low-Power System on Chip
Symbol
Parameter
Min
Typ
Max
Unit
Conditions
COUT
Output capacitance
8
10.0
pF
CI/O
Transceiver capacitance
8
10.0
pF
Standby current consumption
IDD_standby Core, Osc, RTC @2.5 V
I/O @ 3.3 V
TBD
300
TBD
Only 32 kHz oscillator running,
Cache disabled, all other I/O
µA
static, VIH = V_DD ± 0.1 V,
VIL = GND ± 0.1 V
IDD_idle
Idle current consumption
Core, Osc, RTC @2.5 V
I/O @ 2.5 V
TBD
4.2
TBD
Both oscillators running, CPU
static, Cache disabled, LCD
mA
refresh active, VIH = V_DD ± 0.1 V,
VIL = GND ± 0.1 V
At 13 MHz
Operating current consumption
IDD_operatin Core, Osc, RTC @2.5 V
I/O @ 3.3 V
TBD
TBD
All system active, running typical
mA
program, cache disabled, and
LCD inactive
V_DDstandby Standby supply voltage
TBD
Minimum standby voltage for
V
state retention and RTC
operation only
a.
See Table S on page 23.
b.
Assumes buffer has no pull-up or pull-down resistors.
c.
The leakage value given assumes that the pin is configured as an input pin but is not currently being driven.
Note:
1) All power dissipation values can be derived from taking the particular IDD current and multiplying by 2.5 V.
2) The RTC of the EP7309 should be brought up at room temperature. This is required because the RTC OSC will NOT function
properly if it is brought up at –40°C. Once operational, it will continue to operate down to –20°C extended and 0°C
commercial.
3) A typical design will provide 3.3 V to the I/O supply (i.e., V_DDIO), and 2.5 V to the remaining logic. This is to allow the I/O to be
compatible with 3.3 V powered external logic.
4) Pull-up current = 50 µA typical at V_DD = 3.3 V.
10
Copyright 2001 Cirrus Logic (All Rights Reserved)
DS507PP1