HCPL-0720-500E Datasheet, PDF (5/18 Pages) AVAGO TECHNOLOGIES LIMITED – 40 ns Propagation Delay, CMOS Optocoupler

Solder Reflow Thermal Profile
Recommended reflow condition as per JEDEC Standard, J-STD-020 (latest revision). Non-
Halide Flux should be used.
Regulatory Information
The HCPL-772X/072X have been approved by the following organizations:
UL
Recognized under UL 1577, component recognition program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5, File CA88324.
IEC/EN/DIN EN 60747-5-5
Insulation and Safety Related Specifications
  Value
Parameter
Symbol 772X 072X Units
Conditions
Minimum External Air
L(I01) 7.1
4.9
mm
Gap (Clearance)
Measured from input terminals to output
terminals, shortest distance through air.
Minimum External
L(I02) 7.4
4.8
mm
Tracking (Creepage)
Measured from input terminals to output
terminals, shortest distance path along body.
Minimum Internal Plastic
0.08
0.08
mm
Insulation thickness between emitter and
Gap (Internal Clearance)
detector; also known as distance through
insulation.
Tracking Resistance
(Comparative Tracking
Index)
CTI
≥175 ≥175 Volts
DIN IEC 112/VDE 0303 Part 1
Isolation Group
IIIa
IIIa

Material Group
(DIN VDE 0110, 1/89, Table 1)
All Avago data sheets report the creepage and clearance
inherent to the optocoupler component itself. These
dimen­sions are needed as a starting point for the equip-
ment designer when determining the circuit insulation
requirements. However, once mounted on a printed
circuit board, minimum creepage and clearance require­
ments must be met as specified for individual equipment
standards. For creepage, the shortest distance path along
the surface of a printed circuit board between the solder
fillets of the input and output leads must be considered.
There are recommended techniques such as grooves
and ribs which may be used on a printed circuit board to
achieve desired creepage and clearances. Creepage and
clearance distances will also change depending on fac-
tors such as pollution degree and insulation level.
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