HCPL-3180-500E Datasheet, PDF (3/16 Pages) AVAGO TECHNOLOGIES LIMITED – 2.5 Amp Output Current, High Speed, Gate Drive Optocoupler

HCPL-3180 Gull Wing Surface Mount Option 300
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
LAND PATTERN RECOMMENDATION
1.016 (0.040)
6.350 ± 0.25
(0.250 ± 0.010)
10.9 (0.430)
1
2
3
4
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
3.56 ± 0.13
(0.140 ± 0.005)
1.27 (0.050)
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
2.0 (0.080)
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
1.080 ± 0.320
(0.043 ± 0.013)
2.54
(0.100)
BSC
0.635 ± 0.130
(0.025 ± 0.005)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. _PEAK
TEMP.
245°C
200
160°C
150°C
140°C
100
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
3