HCMS-2819 Datasheet, PDF (2/12 Pages) AVAGO TECHNOLOGIES LIMITED – High Performance CMOS 5x7 AlphaNumeric InGaN Blue Display

Package Dimensions
35.56 (1.400) MAX.
2.22 (0.087) SYM.
4.45
(0.175)
TYP.
3.71
(0.146)
TYP.
26
0
1
2
3
4
5
6
7 ^{10.16 (0.400) MAX.}
3
2.11 (0.083) TYP.
PIN # 1 IDENTIFIER
PART NUMBER
DATE CODE (YEAR, WEEK)
INTENSITY CATEGORY
COLOR BIN
COUNTRY OF ORIGIN
0.51
(0.020)
HCMS-281X
YYWW
XZ
COO
5.08 (0.200)
0.51 ± 0.13
(0.020 ± 0.005)
TYP.
2.54 ± 0.13
(0.100 ± 0.005)
TYP.
(NON ACCUM.)
2.54
(0.100)
SYM.
NOTES:
1. DIMENSIONS ARE IN mm (INCHES).
2. UNLESS OTHERWISE SPECIFIED, TOLERANCE ON DIMENSIONS IS ± 0.38 mm (0.015 INCH).
3. LEAD MATERIAL: SOLDER PLATED COPPER ALLOY.
Figure 1. HCMS-2819 package dimension
1.27
(0.050)
SYM.
Device Selection Guide
Description
8 Digit 0.15” Character Height
HCMS-2819
Absolute Maximum Ratings
Logic Supply Voltage, V_LOGIC to GND_LOGIC
-0.3V to 7.0V
LED Supply Voltage, V_LED to GND_LED
Input Voltage, Any Pin to GND
Free Air Operating Temperature Range T_A
Relative Humidity (non-condensing)
-0.3V to 5.5V
-0.3V to V_LOGIC +0.3V
-40qC to +85qC
85%
Storage Temperature, T_S
Maximum Solder Temperature
Solder Dipping
Wave Soldering
-55qC to 100qC
260qC for 5 sec
250qC for 3 sec
ESD Protection @ 1.5 k:, 100pF (each pin)
Class 1, 0-1999V
TOTAL Package Power Dissipation at T_A=25°C
2.4 W
Notes:
For operation in high ambient temperatures, see Appendix A, Thermal Considerations.
2
0.25
(0.010)
4.32
(0.170)
TYP.
7.62
(0.300)
PIN FUNCTION
ASSIGNMENT TABLE
PIN #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
FUNCTION
NO PIN
NO PIN
V LED
NO PIN
NO PIN
NO PIN
GND LED
NO PIN
NO PIN
V LED
NO PIN
NO PIN
NO PIN
DATA IN
RS
NO PIN
CLOCK
CE
BLANK
GND LOGIC
SEL
V LOGIC
NO PIN
RESET
OSC
DATA OUT