AT24C16D_14 Datasheet, PDF (17/27 Pages) ATMEL Corporation – IC-Compatible (2-Wire) Serial EEPROM

10. Ordering Information
Atmel Ordering Code
AT24C16D-SSHM-T⁽¹⁾
AT24C16D-SSHM-B⁽²⁾
AT24C16D-XHM-T⁽¹⁾
AT24C16D-XHM-B⁽²⁾
AT24C16D-MAHM-T⁽¹⁾
AT24C16D-PUM⁽²⁾
AT24C16D-STUM-T⁽¹⁾
AT24C16D-CUM-T⁽¹⁾
AT24C16D-UUM0B-T⁽¹⁾⁽³⁾
AT24C16D-WWU11M⁽⁴⁾
Lead Finish
Package
Voltage
Operation Range
8S1
NiPdAu
(Lead-free/Halogen-free)
8X
Matte Tin
(Lead-free/Halogen-free)
SnAgCu Ball
(Lead-free/Halogen-free)
N/A
8MA2
8P3
5TS1
8U3-1
4U-5
Wafer Sale
1.7V to 3.6V
Industrial Temperature
(–40C to 85C)
Notes: 1. T = Tape and reel:
 SOIC = 4K units per reel
 TSSOP, UDFN, SOT23, and WLCSP = 5K units per reel
2. B = Bulk
 SOIC and TSSOP = 100 units per tube
 PDIP = 50 units per tube
3. The WLCSP package is offered with a backside coating to increase product robustness.
4. For wafer sales, please contact Atmel Sales.
8S1
8X
8MA2
8P3
5TS1
8U3-1
4U-5
Package Type
8-lead, 0.15” wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-pad, 2.00mm x 3.00mm x 0.60mm body, 0.50mm Pitch, Ultra Thin Dual Flat No Lead (UDFN)
8-lead, 0.30" wide, Plastic Dual o Package (PDIP)
5-lead, 1.60mm body, Plastic Thin Shrink Small Outline (SOT23)
8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Very thin Fine Ball Grid Array (VFBGA)
4-ball, 2 x 2 Grid Array, 0.40mm pitch, Wafer Level Chip Scale Package (WLCSP)
AT24C16D [PRELIMINARY DATASHEET] 17
Atmel-8906A-SEEPROM-AT24C16D-Datasheet_042014