PI3039 Datasheet, PDF (2/10 Pages) AMI SEMICONDUCTOR – 600DPI CIS Image Sensor Chip

SYMBOL
SP
CP
VDD
VSS
IOUT
EOS
FUNCTION
Start Pulse: Input to start the line scan.
Clock Pulse: Input to clock the Shift Register.
Positive Supply: +5 volt supply connected to substrate.
VSS is tied to ground: Connection topside common
Video Signal Current Output from a source follower.
End of Scan Pulse: Output from the shift register at end of scan.
Table 1. Pad Symbols and Functions
Read Line
333 µm
SP
8080 µm
PI3039 IMAGE SENSOR, 192 PIXELS, 42 µm PITCH
CP VDD
VSS
IOUT
360 µm
EOS
YX
PAD
SP
CP
VDD
VSS
IOUT
EOS
X
FUNCTION
START INPUT
CLOCK INPUT
+5 SUPPLY
TIED TO GROUND
VIDEO SIGNAL OUT
SCAN OUTPUT
NOTE: ALL PAD OPENINGS ARE 140 X 80 µm
Y
X
30
575
30
2195
30
3295
30
4373
30
5495
30
7272
NOTES:
1. THE DRAWING IS NOT TO SCALE.
2. THE DIE LENGTH AND WIDTH ARE GIVEN AS SHOWN.
3. THE PAD LOCATION ARE GIVEN IN THE TABLE.
4. THERE ARE 2 EXAMPLES OF THE X & Y LOCATIONS
SHOWN ON THE FIRST 2 PADS.
5. ALL DIMENSIONS ARE IN µm.
Figure 2. Bonding Pad Layout Diagram:
Figure 2 shows the bonding pad locations for PI3039 Sensor Chip. The locations are referenced to the
lower left corner of the die.
Electro-Optical Characteristics (25^o C)
Table 2, below, lists the electro-optical characteristics of PI3039 sensor chip at 25^o C.
Parameters
Number of Photo-elements
Pixel-to-pixel spacing
Chip scanning rate
Symbols
Tint ⁽¹⁾
Clock frequency
fclk ⁽²⁾
IOUT (Saturation charge
Qsat ⁽³⁾
output for a given sample time)
At 5.0 MHz clock frequency.
Typical
192
42
38.4
5.0
170 to 200
Units
elements
µm
µsec
MHz
pC
Notes
@ typical 5 MHz pixel rate.
See note 2.
See note 2
With 570nm light source.
At saturation exposure of
5.7 Joules/cm²
PAGE 2 OF 10, PI3039, 12/2/02