PI3039 Datasheet, PDF (1/10 Pages) AMI SEMICONDUCTOR – 600DPI CIS Image Sensor Chip

™ _Peripheral
Imaging
Corporation
PI3039
600DPI CIS Image Sensor Chip
Engineering Data Sheet
Description:
Peripheral Imaging Corporation PI3039 CIS (Contact Image Sensor) sensor chip is a linear
array image sensor chip with a 600 elements per inch resolution. The sensor chip is fabricated
with PIC’s proprietary CMOS Image Sensing Technology. Since this image sensor chip is
intended for CIS module applications, multiple numbers of these sensors will be serially
cascaded to form a linear scanning image array of arbitrary length. These sensors are butted
end-to-end on a printed circuit board (PCB). The sensors are mounted using the chip-on-
board technology to form scanning arrays with various lengths
8080 µm
1
2
3
4
ROW OF 192 SENSORS ¹⁸⁹ 190 191 192
AND VIDEO SIGNAL
LINE MULTIPLEXER
READ OUT SHIFT REGISTER
360 µm
BUFFER
SP
BUFFER
CP
VDD
VSS
CHIP
SELECT
IOUT
BUFFER
EOS
Figure 1. PI3039 Sensor Block Diagram
Figure 1 is a block diagram of the sensor chip. Each sensor chip consists of 192 detector elements,
their associated multiplexing switches, buffer amplifiers, and a chip selector. The detector's element-
to-element spacing is approximately 42µm. The size of each chip without the scribe lines is 8080 µm
by 360 µm. Each sensor chip has 6 bonding pads. The pad symbols and functions are described in
Table 1.
Page 1 of 10, PI3039, 12/2/02