ADP1823 Datasheet, PDF (5/32 Pages) Analog Devices – Dual, Interleaved, Step-Down DC-to-DC Controller with Tracking

ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
IN, EN1, EN2
BST1, BST2
BST1, BST2 to SW1, SW2
CSL1, CSL2
SW1, SW2
DH1
DH2
DL1, DL2 to PGND
PGND to GND
LDOSD, SYNC, FREQ, COMP1,
COMP2, SS1, SS2, FB1, FB2, VREG,
PV, POK1, POK2, TRK1, TRK2
θJA 4-Layer
(JEDEC Standard Board)^{1, 2}
Operating Ambient Temperature³
Operating Junction Temperature³
Storage Temperature
Rating
−0.3 V to +20 V
−0.3 V to +30 V
−0.3 V to +6 V
−1 V to +30 V
−2 V to +30 V
SW1 − 0.3 V to BST1 + 0.3 V
SW2 − 0.3 V to BST2 + 0.3 V
−0.3 V to PV + 0.3 V
±2 V
−0.3 V to +6 V
45°C/W
−40°C < TA< +85°C
−40°C < TJ < +125°C
−65°C to +150°C
1 _{Measured with exposed pad attached to PCB.}
2 _{Junction-to-ambient thermal resistance (θJA) of the package is based on}
modeling and calculation using a 4-layer board. The junction-to-ambient
thermal resistance is application and board-layout dependent. In
applications where high maximum power dissipation exists, attention to
thermal dissipation issues in board design is required. For more information,
please refer to Application Note AN-772, A Design and Manufacturing Guide
for the Lead Frame Chip Scale Package (LFCSP).
3 _{In applications where high power dissipation and poor package thermal}
resistance are present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (TA_MAX) is dependent on the
maximum operating junction temperature (TJ_MAX_OP = 125^oC), the maximum
power dissipation of the device in the application (PD_MAX), and the junction-
to-ambient thermal resistance of the part/package in the application (θJA), is
given by the following equation: TA_MAX = TJ_MAX_OP – (θJA x PD_MAX).
ADP1823
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. A | Page 5 of 32