XA3S1500-4FGG456I Datasheet, PDF (2/8 Pages) Xilinx, Inc – Revolutionary 90-nanometer process technology

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Introduction and Ordering Information
♦ Fast look-ahead carry logic
♦ Dedicated 18 x 18 multipliers
♦ JTAG logic compatible with IEEE 1149.1/1532
• SelectRAM™ hierarchical memory
♦ Up to 576 Kbits of total block RAM
♦ Up to 208 Kbits of total distributed RAM
• Digital Clock Manager (up to four DCMs)
♦ Clock skew elimination
♦ Frequency synthesis
♦ High-resolution phase shifting
♦ Maximum clock frequency 125 MHz
• Fully supported by Xilinx ISE® software development
system
♦ Synthesis, mapping, placement and routing
• MicroBlaze™ processor, CAN, LIN, MOST, and other
cores
• Pb-free packaging options
• Xilinx and all of our production partners are qualified to
ISO-TS16949
Please refer to the Spartan-3 complete data sheet (DS099)
for a full product description, AC and DC specifications, and
package pinout descriptions
Architectural Overview
The Spartan-3 family architecture consists of five
fundamental programmable functional elements:
• Configurable Logic Blocks (CLBs) contain RAM-based
Look-Up Tables (LUTs) to implement logic and storage
elements that can be used as flip-flops or latches.
CLBs can be programmed to perform a wide variety of
logical functions as well as to store data.
• Input/Output Blocks (IOBs) control the flow of data
between the I/O pins and the internal logic of the
device. Each IOB supports bidirectional data flow plus
3-state operation. Twenty-six different signal standards,
including eight high-performance differential standards,
are available as shown in Table 2. Double Data-Rate
(DDR) registers are included. The Digitally Controlled
Impedance (DCI) feature provides automatic on-chip
terminations, simplifying board designs.
• Block RAM provides data storage in the form of 18-Kbit
dual-port blocks.
• Multiplier blocks accept two 18-bit binary numbers as
inputs and calculate the product.
• Digital Clock Manager (DCM) blocks provide
self-calibrating, fully digital solutions for distributing,
delaying, multiplying, dividing, and phase shifting clock
signals.
These elements are organized as shown in Figure 1. A ring
of IOBs surrounds a regular array of CLBs. The XA3S50
has a single column of block RAM embedded in the array.
Those devices ranging from the XA3S200 to the XA3S1500
have two columns of block RAM. Each column is made up
of several 18 Kbit RAM blocks; each block is associated
with a dedicated multiplier. The DCMs are positioned at the
ends of the block RAM columns.
The Spartan-3 family features a rich network of traces and
switches that interconnect all five functional elements,
transmitting signals among them. Each functional element
has an associated switch matrix that permits multiple
connections to the routing.
DS314 (v1.3) June 18, 2009
www.xilinx.com
Product Specification
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