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XC2C128-7VQG100I Datasheet, PDF (14/18 Pages) Xilinx, Inc – Optimized for 1.8V systems
XC2C128 CoolRunner-II CPLD
R
Part Number
XC2C128-7CP132I
XC2C128-7TQ144I
XC2C128-7VQG100I
XC2C128-7CPG132I
XC2C128-7TQG144I
Pin/Ball θJA
θJC
Spacing (C/Watt) (C/Watt)
Package Type
Comm.
Package Body
(C)
Dimensions I/O Ind. (I)(1)
0.5mm 72.4
15.7 Chip Scale Package 8mm x 8mm 100
I
0.5mm 46.1
7.9 Thin Quad Flat Pack 20mm x 20mm 100
I
0.5mm 47.5
12.5 Very Thin Quad Flat 14mm x 14mm 80
I
Pack; Pb-free
0.5mm 72.4
15.7
Chip Scale
8mm x 8mm 100
I
Package; Pb-free
0.5mm 46.1
7.9
Thin Quad Flat
20mm x 20mm 100
I
Pack; Pb-free
Notes: C = Commercial (T A = 0° C to +70° C); I = Industrial (T A = –40° C to +85° C).
Standard Example: XC2C128 -6 TQ 144 C Pb-Free Example: XC2C128 -6 TQ G 144 C
Device
Speed Grade
Package Type
Number of Pins
Temperature Range
Device
Speed Grade
Package Type
Pb-Free
Number of Pins
Temperature Range
Device Part Marking
Device Type
Package
Speed
Operating Range
R
XC2Cxxx
TQ144
7C
This line not
related to device
part number
Part Marking for all non chip scale packages
Figure 5: Sample Package with Part Marking
Note: Due to the small size of chip scale packages, the complete ordering part number cannot be included on the package
marking. Part marking on chip scale packages by line are:
• Line 1 = X (Xilinx logo) then truncated part number
• Line 2 = Not related to device part number
• Line 3 = Not related to device part number
• Line 4 = Package code, speed, operating temperature,
three digits not related to device part number. Package
codes: C5 = CP132, C6 = CPG132.
14
www.xilinx.com
DS093 (v3.2) March 8, 2007
Product Specification