W83176R-732 Datasheet, PDF (9/11 Pages) Winbond – WINBOND 2DIMM DDR ZERO DELAY BUFFER FOR SIS CHIPSET

W83176R-732
D.C. Characteristics, continued.
PARAMETER
CLKIN, FBIN Input Voltage
Low
CLKIN, FBIN Input Voltage
High
Input Pin Capacitance
Output Pin Capacitance
Input Pin Inductance
SYM.
V_IL
V_IH
C_IN
C_OUT
L_IN
MIN.
TYP.
MAX.
0.4
UNITS TEST CONDITIONS
V_dc Fin = 100 to 200 MHz
2.1
V_dc Fin = 100 to 200 MHz
5
pF
6
pF
7
nH
9. ORDERING INFORMATION
PART NUMBER
W83176R_732
PACKAGE TYPE
28-pin SSOP
PRODUCTION FLOW
Commercial, 0°C to +70°C
10. HOW TO READ THE TOP MARKING
W83176R-732
28051234
342GB
1st line: Winbond logo and the type number: W83176R-732
2nd line: Tracking code 2 8051234
2: wafers manufactured in Winbond FAB 2
8051234: wafer production series lot number
3rd line: Tracking code 342 G B
342: packages made in '2003, week 42
G: assembly house ID; O means OSE, G means GR
B: IC revision
All the trade marks of products and companies mentioned in this data sheet belong to their
respective owners.
Publication Release Date: April 13, 2005
-7-
Revision 1.1