W83176R-732 Datasheet, PDF (10/11 Pages) Winbond – WINBOND 2DIMM DDR ZERO DELAY BUFFER FOR SIS CHIPSET

W83176R-732
11. PACKAGE DRAWING AND DIMENSIONS
28-pin 209 mil
D
2
HE E
1
SEATING PLANE
Y
e
b
15
DIMENSION IN MM DIMENSION IN INCH
SYMBOL
MIN. NOM MAX. MIN. NOM MAX.
A
2.00
0.079
DTEAIL A
A1 0.05
0.002
A2 1.65 1.75 1.85 ^0.065 0.069 0.073
b 0.22
0.38 0.009
0.015
c 0.09
0.25 0.004
0.010
D 9.90 10.20 10.50 0.389 0.401 0.413
E ^5.00 5.30 5.60 0.197 0.209 0.220
HE _7.40 7.80 8.20 _{0.291 0.307 0.323}
e
0.65
0.0256
L 0.55 0.75 ^0.95 0.021 0.030 ^0.037
L1
1.25
0.050
Y
0.10
0.004
14
θ
0
80
8
A2 A
A1
θ_L
DETAIL A L1
SEATING PLANE
-8-