English
Language : 

W24L010A Datasheet, PDF (9/9 Pages) Winbond – 128K X 8 High Speed CMOS Static RAM
Package Dimensions, continued
32-pin TSOP
HD
D
Me
0.10(0.004)
b
θL
L1
W24L010A
c
E
A
A2
A1
Y
Symbol
A
A1
Dimension in Inches
Min.
__
0.002
Nom.
__
__
Max.
0.047
0.006
Dimension in mm
Min. Nom.
__ __
__
0.05
Max.
1.20
0.15
A 2 0.037 0.039 0.041 0.95 1.00 1.05
b
0.007 0.008 0.009 0.17 0.20 0.23
c
0.005 0.006 0.007 0.12 0.15 0.17
D
0.720 0.724 0.728 18.30 18.40 18.50
E
0.311 0.315 0.319 7.90 8.00 8.10
H D 0.780 0.787 0.795 19.80 20.00 20.20
e
__
__ __
__
0.020
0.50
L
0.016 0.020 0.024 0.40 0.50 0.60
L1
__
__ __
__
0.031
0.80
Y
0.000
__
0.004 0.00
__
0.10
θ
1
3
5
1
3
5
Note:
Controlling dimension: Millimeter
Headquarters
Winbond Electronics (H.K.) Ltd.
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5792647
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-7197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2730 Orchard Parkway, San Jose,
CA 95134, U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
Note: All data and specifications are subject to change without notice.
Publication Release Date: September 1999
-9-
Revision A2