W24L010A Datasheet, PDF (8/9 Pages) Winbond – 128K X 8 High Speed CMOS Static RAM

W24L010A
PACKAGE DIMENSIONS
32-pin P-DIP Skinny (300 mil)
32
E1
1
S
A A2
L
D
B1
e1
B
17
16
E
Base Plane
A1
Mounting Plane
a
eA
Dimension in Inches Dimension in mm
Symbol
Min. Nom. Max. Min. Nom. Max.
A
0.200
5.08
A1
0.015
0.38
A2
0.145 0.150 0.155 3.68 3.81 3.94
B
0.016 0.018 0.022 0.41 0.46 0.56
B1
0.058 0.060 0.064 1.47 1.52 1.63
c
0.008 0.010 0.014 0.20 0.25 0.36
D
1.60 1.62
40.64 41.15
E
0.295 0.315 0.335 7.49 8.00 8.50
E1
0.286 0.290 0.294 7.26 7.36 7.46
e1
0.090 0.100 0.110 2.29 2.54 2.79
L
0.120 0.130 0.140 3.05 3.30 3.56
a
0
15
0°
15°
eA
0.430 0.450 0.470 10.92 11.43 11.94
S
0.065
1.65
Notes:
1. Dimension D Max. & S include mold flash or
c
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include mold mismatch and
are determined at the mold parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
32-pin SOJ
32
1
D
S
B
e
b
Seating Plane
17
E He
16
Symbol
A
A1
A2
B
b
c
D
E
e
e1
He
L
S
Y
θ
Dimension in Inches
Dimension in mm
Min.
__
0.020
Nom.
__
__
Max.
0.140
__
Min.
__
0.508
Nom.
__
__
Max.
3.556
__
0.095 0.100 0.105 2.413 2.540 2.667
0.026 0.028 0.032 0.660 0.711 0.813
0.016 0.018 0.022 0.406 0.457 0.559
0.008 0.010 0.014 0.203 0.254 0.356
0.815 0.825 0.835 20.701 20.955 21.209
0.295 0.300 0.305 7.493 7.620 7.747
0.044 0.050 0.056 1.118 1.270 1.422
0.247 0.267 0.287 6.274 6.782 7.290
0.325
0.080
__
__
0
0.335
__
__
__
__
0.345
__
0.045
0.004
10
8.255
2.032
__
__
0°
8.509
__
__
__
__
8.763
__
1.143
0.102
10°
A2 A
c
L
A1
Y
e1
θ
-8-