W2465 Datasheet, PDF (9/10 Pages) Winbond – 8K X 8 CMOS STATIC RAM

W2465
PACKAGE DIMENSIONS
28-pin P-DIP
28
E1
1
S
A A2
L
D
15
B
e1
B1
14
E
A1 _{Base Plane}
Seating Plane
a
eA
Symbol ^{Dimension in Inches Dimension in mm}
Min. Nom. Max. Min. Nom. Max.
A
0.210
5.33
A1
0.010
0.25
A2
0.150 0.155 0.160 3.81 3.94 4.06
B
0.016 0.018 0.022 0.41 0.46 0.56
B1
0.058 0.060 0.064 1.47 1.52 1.63
c
0.008 0.010 0.014 0.20 0.25 0.36
D
1.460 1.470
37.08 37.34
E
0.590 0.600 0.610 14.99 15.24 15.49
E1
0.540 0.545 0.550 13.72 13.84 13.97
e1
0.090 0.100 0.110 2.29 2.54 2.79
L
0.120 0.130 0.140 3.05 3.30 3.56
a
0
15
0
15
eA
0.630 0.650 0.670 16.00 16.51 17.02
S
0.090
2.29
Notes:
1. Dimension D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
c
3. Dimension D & E1 include mold mismatch and
are determined at the mold parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
28-pin P-DIP Skinny
D
28
E1
1
S
A A2
L
B
e1
B1
15
14
Base Plane
A1
E
c
Mounting Plane
a
eA
Symbol ^{Dimension in Inches Dimension in mm}
Min. Nom. Max. Min. Nom. Max.
A
0.175
4.45
A1
0.010
0.25
A2
0.125 0.130 0.135 3.18 3.30 3.43
B
0.016 0.018 0.022 0.41 0.46 0.56
B1
0.058 0.060 0.064 1.47 1.52 1.63
c
0.008 0.010 0.014 0.20 0.25 0.36
D
1.388 1.400
35.26 35.56
E
0.300 0.310 0.320 7.62 7.87 8.13
E1
0.283 0.288 0.293 7.19 7.32 7.44
e1
0.090 0.100 0.110 2.29 2.54 2.79
L
0.120 0.130 0.140 3.05 3.30 3.56
a
0°
15°
0°
15°
eA
0.330 0.350 0.370 8.38 8.89 9.40
S
0.055
1.40
Notes:
1. Dimension D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include mold mismatch and
are determined at the mold parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
Publication Release Date: April 1997
-9-
Revision A8