W2465 Datasheet, PDF (8/10 Pages) Winbond – 8K X 8 CMOS STATIC RAM

W2465
BONDING PAD DIAGRAM
5 4 3 2 1 27S-2 27S-1 26 25 24 23 22
A4
A5
A6
A7
A12
V_DD
VDD
WE ^CS2
A8
A9
A11
6
21
A3
OE
Y
X
7
13S-2
20
A2
V_SS
A10
13S-1
8 9 10 11 12
14 15 16 17 18 19
V_SS
A1 A0 O0 O1 O2
03 O4 O5 O6 O7 _CS1
PAD NO.
1
2
3
4
5
6
7
8
9
10
11
12
13S-1
13S-2
14
15
16
17
18
19
20
21
22
23
24
25
26
27S-1
27S-2
X
-226.95
-350.95
-484.10
-608.10
-739.75
-741.75
-741.75
-741.75
-610.60
-481.50
-343.80
-206.10
-73.00
-8.35
60.10
193.30
332.40
465.60
603.30
738.15
740.15
740.15
738.15
606.50
482.50
349.35
225.35
94.20
-50.40
Y
1526.15
1526.15
1526.15
1526.15
1526.15
1315.10
-1231.85
-1456.30
-1456.30
-1466.30
-1466.30
-1466.30
-1401.10
-1212.80
-1466.30
-1466.30
-1466.30
-1466.30
-1466.30
-1456.30
-1221.45
1310.80
1526.15
1526.15
1526.15
1526.15
1526.15
1526.15
1456.10
Note: For bare chip form (C.O.B.) applications, the substrate must be connected to VDD or left floating in the PCB layout.
-8-