W2465 Datasheet, PDF (10/10 Pages) Winbond – 8K X 8 CMOS STATIC RAM

W2465
Package Dimensions, continued
28-pin SO Wide Body
28
15
e1
E HE
L
1
14
b
Detail F
D
A2 A
S
e
y
A1
Seating Plane
e1
c
LE
See Detail F
Symbol ^{Dimension in Inches Dimension in mm}
Min. Nom. Max. Min. Nom. Max.
A
0.112
2.85
A1
0.004
0.10
A2
0.093 0.098 0.103 2.36 2.49 2.62
b
0.014 0.016 0.020 0.36 0.41 0.51
c
0.008 0.010 0.014 0.20 0.25 0.36
D
0.713 0.733
18.11 18.62
E
0.326 0.331 0.336 8.28 8.41 8.53
e
0.044 0.050 0.056 1.12 1.27 1.42
HE
0.453 0.465 0.477 11.51 11.81 12.12
L
0.028 0.036 0.044 0.71 0.91 1.12
LE
0.059 0.067 0.075 1.50 1.70 1.91
S
0.047
1.19
y
0.004
0.10
θ
0
10
0
10
Notes:
1. Dimension D Max. & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Danimd ednesteiornmDine&dEatinthc.elumdeolmd opladrtminigsmlinaetc.h
4. Controlling dimension: Inches.
5. General appearance spec should be based
on final visual inspection spec.
Headquarters
Winbond Electronics (H.K.) Ltd.
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: [phone]
FAX: [phone]
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-7197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: [phone]
FAX: [phone]
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2730 Orchard Parkway, San Jose,
CA 95134, U.S.A.
TEL: [phone]
FAX: [phone]
Note: All data and specifications are subject to change without notice.
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