W9725G6KB25I-TR Datasheet, PDF (86/87 Pages) Winbond – 4M X 4 BANKS X 16 BIT DDR2 SDRAM

W9725G6KB
12. PACKAGE SPECIFICATION
Package Outline WBGA-84 (8x12.5 mm²)
E1
A ^{// bbb C}
A1
eE
E
PIN A1 INDEX
PIN A1 INDEX
987
321
A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
aaa C 4X
B
84xΦb
SOLDER BALL DIAMETER REFERS.
TO POST REFLOW CONDITION.
ddd M C A B
eee M C
THE WINDOW-SIDE
ENCAPSULANT
SYMBOL
DIMENSION (MM)
MIN.
NOM.
MAX.
A
---
---
1.20
A1
0.25
---
0.40
b
0.40
---
0.50
D
12.40 12.50
12.60
E
7.90
8.00
8.10
D1
11.20 BSC.
E1
6.40 BSC.
eE
0.80 BSC.
eD
0.80 BSC.
aaa
---
---
0.15
bbb
---
---
0.20
ccc
---
---
0.10
ddd
---
---
0.15
eee
---
---
0.08
ccc C
C
SEATING PLANE
Ball Land
Ball Opening
Note: 1. Ball land : 0.5mm
2. Ball opening : 0.4mm
3. PCB Ball land suggested ≤ 0.4mm
- 86 -
Publication Release Date: Sep. 03, 2012
Revision A03