W9725G6JB Datasheet, PDF (86/87 Pages) Winbond – 4M  4 BANKS  16 BIT DDR2 SDRAM

W9725G6JB
11. PACKAGE SPECIFICATION
Package Outline WBGA-84 (8x12.5 mm²)
E1
A ^{// bbb C}
A1
eE
E
PIN A1 INDEX
PIN A1 INDEX
987
321
A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
aaa C 4X
B
84xΦb
THE WINDOW-SIDE
ENCAPSULANT
SOLDER BALL DIAMETER REFERS.
TO POST REFLOW CONDITION.
ccc C
C
SEATING PLANE
SYMBOL
A
A1
b
D
E
D1
E1
eE
eD
aaa
bbb
ccc
DIMENSION (MM)
MIN.
NOM.
MAX.
---
---
1.20
0.25
---
0.40
0.40
---
0.50
12.40
12.50
12.60
7.90
8.00
8.10
11.20 BSC.
6.40 BSC.
0.80 BSC.
0.80 BSC.
---
---
0.15
---
---
0.20
---
---
0.10
Ball Land
Ball Opening
Note: 1. Ball land : 0.5mm
2. Ball opening : 0.4mm
3. PCB Ball land suggested ≤ 0.4mm
- 86 -
Publication Release Date: Nov. 29, 2011
Revision A02