W25Q16DW Datasheet, PDF (79/83 Pages) Winbond – 1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

8-Contact 6x5mm WSON Cont’d.
W25Q16DW
SYMBOL
M
N
P
Q
R
MILLIMETERS
Min
Nom Max
Min
SOLDER PATTERN
3.40
4.30
6.00
0.50
0.75
INCHES
Nom
0.134
0.169
0.236
0.020
0.026
Max
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. It is recommended to connect the metal pad area on the bottom center of the package to the ground (GND pin). Avoid placement
of exposed PCB vias under the pad.
- 79 -
Publication Release Date: April 01, 2011
Preliminary - Revision A