W25Q16DW Datasheet, PDF (76/83 Pages) Winbond – 1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

12. PACKAGE SPECIFICATION
12.1 8-Pin SOIC 150-mil (Package Code SN)
8
5
W25Q16DW
c
E H_E
1
4
D
L
0.25
θ
Y
SEATING PLANE
b
SYMBOL
A
A1
b
c
E⁽³⁾
D⁽³⁾
e⁽²⁾
H_E
Y⁽⁴⁾
L
θ
A
e
A1
MILLIMETERS
Min
1.35
0.10
0.33
0.19
3.80
4.80
5.80
---
0.40
0°
1.27 BSC
Max
1.75
0.25
0.51
0.25
4.00
5.00
6.20
0.10
1.27
10°
GAUGE PLANE
INCHES
Min
Max
0.053
0.069
0.004
0.010
0.013
0.020
0.008
0.010
0.150
0.157
0.188
0.196
0.050 BSC
0.228
0.244
---
0.004
0.016
0.050
0°
10°
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
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