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| W25Q80BWSSIG-TR Datasheet, PDF (72/75 Pages) Winbond – 1.8V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |||
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W25Q80BW
10. ORDERING INFORMATION
W = Winbond
W(1) 25Q 80B W xx(2)
25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
80B = 8M-bit
W = 1.65V to 1.95V
SN = 8-pin SOIC 150-mil SV = 8-pin VSOP 150-mil
ZP = 8-pad WSON 6x5-mm UX = 8-Pad USON 2x3mm
BY = 8-ball WLCSP(WLBGA)
SS = 8-pin SOIC 208-mil
UU = 8-Pad USON 4x3mm
I = Industrial (-40°C to +85°C)
(3,4)
G = Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
P = Green Package with Status Register Power-Down & OTP enabled
L = Special driver strength version for certain applications(5)
B = Special driver strength version for certain applications(5)
C = WLCSP/WLBGA package with backside coating
E = Green Package with Extended Pad
Notes:
1. The âWâ prefix is not included on the part marking.
2. Only the 2nd letter is used for the part marking.
WSON package type ZP is not used for the part marking.
3. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and
Reel (shape T) or Tray (shape S), when placing orders.
4. For shipments with OTP feature enabled, please contact Winbond
5. Driver strength for âLâ is PMOS:NMOS = 25% : 25%
Driver strength for âBâ is PMOS:NMOS = 75% : 25%
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