W25Q80BWSSIG-TR Datasheet, PDF (69/75 Pages) Winbond – 1.8V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

9.5 8-Pad USON 2x3-mm (Package Code UX)
W25Q80BW
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad.
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Publication Release Date: September 01, 2014
Revision L