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W83782D Datasheet, PDF (70/73 Pages) Winbond – MONITORING IC
Preliminary W83782D
10. PACKAGE DIMENTIONS
(48-pin QFP)
HD
D
36
25
37
24
E HE
48
13
1
e
b 12
Seating Plane
See Detail F
A2 A
A1
y
c
L
L1
Detail F
Symbol
A
A1
A2
b
c
D
E
e
HD
HE
L
L1
y
0
Dimension in inch
Min. Nom. Max.
Dimension in mm
Min. Nom. Max.
---
---
0.05 ---
1.35 1.40
1.60
0.15
1.45
0.17 0.20
0.09 ---
0.27
0.20
7.00
7.00
0.50
9.00
9.00
0.45 0.60 0.75
1.00
--- 0.08 ---
0
3.5
7
Notes:
1. Dimensions D & E do not include interlead
flash.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeters
4. General appearance spec. should be based
on final visual inspection spec.
Headquarters
No. 4, Creation Rd. III
Science-Based Industrial Park
Hsinchu, Taiwan
TEL: 886-35-770066
FAX: 886-35-789467
www: http://www.winbond.com.tw/
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
TLX: 16485 WINTPE
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II
123 Hoi Bun Rd., Kwun Tong
Kowloon, Hong Kong
TEL: 852-27516023-7
FAX: 852-27552064
Winbond Electronics
(North America) Corp.
2730 Orchard Parkway
San Jose, CA 95134 U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
Please note that all data and specifications are subject to change without
notice. All the trade marks of products and companies mentioned in this data
sheet belong to their respective owners.
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