W949D6CB Datasheet, PDF (58/60 Pages) Winbond – 512Mb Mobile LPDDR

W949D6CB / W949D2CB
10. ORDERING INFORMATION
512Mb Mobile LPDDR
Mobile LPDDR/LPSDR SDRAM Package Part Numbering
W 94 9 D 6 C B H X 5 I
Product Line
98:mobile LPSDR SDRAM
94:mobile LPDDR SDRAM
Density
7:2⁷=128M 8:2⁸=256M
9:2⁹=512M
Power Supply
D:1.8/1.8 V_DD / V_DDQ
I/O Ports width
6:16bit
2:32bit
Generation
Design revision.
Package or KGD
K: KGD
B: BGA
Temperature
with standard Idd6
G:-25C~85C
with low power Idd6
E:-25C~85C
I:-40C~85C
Clock rate
5:5ns200MHz
6:6ns166MHz
7:7.5ns133MHz
Package Material
X: Lead-free + Halogen-free
Package configuration code
G: 54VFBGA, 8mmx9mm
H: 60VFBGA, 8mmx9mm
J: 90VFBGA, 8mmx13mm
Part number
W949D6CBHX5I
W949D6CBHX5E
W949D6CBHX6E
W949D6CBHX6G
W949D2CBJX5I
W949D2CBJX5E
W949D2CBJX6E
W949D2CBJX6G
V_DD/V_DDQ
1.8V/1.8V
1.8V/1.8V
1.8V/1.8V
1.8V/1.8V
1.8V/1.8V
1.8V/1.8V
1.8V/1.8V
1.8V/1.8V
I/O width Package
Others
16 60VFBGA 200MHz, -40C~85C, Low power
16 60VFBGA 200MHz, -25C~85C, Low power
16 60VFBGA 166MHz, -25C~85C, Low power
16 60VFBGA 166MHz, -25C~85C
32 90VFBGA 200MHz, -40C~85C, Low power
32 90VFBGA 200MHz, -25C~85C, Low power
32 90VFBGA 166MHz, -25C~85C, Low power
32 90VFBGA 166MHz, -25C~85C
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Publication Release Date: Sep, 21, 2011
Revision A01-007