W949D6CB Datasheet, PDF (46/60 Pages) Winbond – 512Mb Mobile LPDDR

W949D6CB / W949D2CB
8. ELECTRICAL CHARACTERISTIC
8.1 Absolute Maximum Ratings
PARAMETER
Voltage on VDD relative to VSS
Voltage on VDDQ relative to VSS
Voltage on any pin relative to VSS
Operation Case Temperature
Storage Temperature
Short Circuit Output Current
Power Dissipation
512Mb Mobile LPDDR
SYMBOL
VDD
VDDQ
VIN, VOUT
Tc
TSTG
IOUT
PD
VALUES
MIN
MAX
−0.3
2.7
−0.3
2.7
−0.3
2.7
-25
85
-40
85
−55
150
±50
1.0
UNITS
V
V
V
°C
°C
mA
W
8.2 Input/Output Capacitance
PARAMETER
SYMBOL MIN MAX UNITS NOTES
Input capacitance, CK, CK
CCK 1.5 3.0
pF
Input capacitance delta, CK, CK
CDCK
0.25
pF
Input capacitance, all other input-only pins
CI
1.5 3.0
pF
Input capacitance delta, all other input-only pins CDI
0.5
pF
Input/ output capacitance, DQ,DM,DQS
CIO 3.0 5.0
pF
3
Input/output capacitance delta, DQ, DM, DQS CDIO
0.50
pF
3
Notes:
1. These values are guaranteed by design.
2. These capacitance values are for package with single monolithic devices only. Multiple die packages will have parallel capacitive loads.
3. Although DM is an input-only pin, the input capacitance of this pin must model the input capacitance of the DQ and DQS pins. This is
required to match signal propagation times of DQ, DQS and DM in the system.
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Publication Release Date: Sep, 21, 2011
Revision A01-007