W949D6CB Datasheet, PDF (56/60 Pages) Winbond – 512Mb Mobile LPDDR

W949D6CB / W949D2CB
9. PACKAGE DIMENSIONS
512Mb Mobile LPDDR
9.1: LPDDR X 16
VBGA60Ball (8X9 MM^2, Ball pitch:0.8mm)
Note:
1. Ball land:0.5mm. Ball opening:0.4mm. PCB Ball land suggested ≦0.4mm
2. Dimensions apply to Solder Balls Post-Reflow. The Pre-Reflow diameter is 0.42 on a 0.4 SMD Ball Pad.
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Publication Release Date: Sep, 21, 2011
Revision A01-007