W25Q80 Datasheet, PDF (57/61 Pages) Winbond – 8M-BIT, 16M-BIT AND 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q80, W25Q16, W25Q32
12.5 16-Pin SOIC 300-mil (Package Code SF)
SYMBOL
A
A1
b
C
D⁽³⁾
E
E1⁽³⁾
e⁽²⁾
L
θ
y
MILLIMETERS
MIN
MAX
2.36
2.64
0.10
0.30
0.33
0.51
0.18
0.28
10.08 10.49
10.01 10.64
7.39
7.59
1.27 BSC
0.39
1.27
0^o
8^o
---
0.076
INCHES
MIN
MAX
0.093 0.104
0.004 0.012
0.013 0.020
0.007 0.011
0.397 0.413
0.394 0.419
0.291 0.299
0.050 BSC
0.015 0.050
0^o
8^o
---
0.003
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
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Publication Release Date: September 26, 2007
Preliminary - Revision B