W83791D Datasheet, PDF (41/46 Pages) Winbond – W83791D Winbond H/W Monitoring IC

W83791D
11 PACKAGE SPECIFICATION
(48-pin QFP)
HD
D
36
25
37
24
E HE
48
13
1
e
b ¹²
Seating Plane
See Detail F
A2 A
A1
y
c
L
L1
Detail F
Preliminary
Dimension in inch
Symbol _{Min. Nom. Max.}
A
A1
A2
b
c
D
E
e
HD
HE
L
L1
y
0
Dimension in mm
Min. Nom. Max.
---
0.05
1.35
0.17
0.09
---
---
1.40
0.20
---
1.60
0.15
1.45
0.27
0.20
7.00
7.00
0.50
9.00
9.00
0.45 0.60 0.75
1.00
--- 0.08 ---
0
3.5
7
Notes:
1. Dimensions D & E do not include interlead
flash.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeters
4. General appearance spec. should be based
on final visual inspection spec.
Headquarters
No. 4, Creation Rd. III
Science-Based Industrial Park
Hsinchu, Taiwan
TEL: [phone]
FAX: [phone]
www: http://www.winbond.com.tw/
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.
Taipei, Taiwan
TEL: [phone]
FAX: [phone]
TLX: 16485 WINTPE
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II
123 Hoi Bun Rd., Kwun Tong
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]
Winbond Electronics
(North America) Corp.
2730 Orchard Parkway
San Jose, CA 95134 U.S.A.
TEL: [phone]
FAX: [phone]
Please note that all data and specifications are subject to change without notice. All the trade
marks of products and companies mentioned in this data sheet belong to their respective owner
34
Publication Release Date: Aug, 2001
Revision 0.41