W29GL128CH9C-TR Datasheet, PDF (4/67 Pages) Winbond – 128M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODE

W29GL128C
8.1 Absolute Maximum Stress Ratings ............................................................................... 29
8.2 Operating Temperature and Voltage ............................................................................ 29
8.3 DC Characteristics ........................................................................................................ 30
8.4 Switching Test Circuits.................................................................................................. 31
8.4.1 Switching Test Waveform ...............................................................................................31
8.5 AC Characteristics ........................................................................................................ 32
8.5.1 Instruction Write Operation .............................................................................................33
8.5.2 Read / Reset Operation .................................................................................................. 34
8.5.3 Erase/Program Operation ............................................................................................... 36
8.5.4 Write Operation Status....................................................................................................46
8.5.5 WORD/BYTE CONFIGURATION (#BYTE).....................................................................50
8.5.6 DEEP POWER DOWN MODE........................................................................................52
8.5.7 WRITE BUFFER PROGRAM..........................................................................................52
8.6 Recommended Operating Conditions........................................................................... 53
8.6.1 At Device Power-up ........................................................................................................ 53
8.7 Erase and Programming Performance ......................................................................... 54
8.8 Data Retention .............................................................................................................. 54
8.9 Latch-up Characteristics ............................................................................................... 54
8.10 Pin Capacitance ............................................................................................................ 54
9
PACKAGE DIMENSIONS ......................................................................................................... 55
9.1 TSOP 56-pin 14x20mm ................................................................................................ 55
9.2 Thin & Fine-Pitch Ball Grid Array, 56 ball, 7x9mm (TFBGA56) .................................... 56
9.3 Low-Profile Fine-Pitch Ball Grid Array, 64-ball 11x13mm (LFBA64) ............................ 57
10 ORDERING INFORMATION..................................................................................................... 58
10.1 Ordering Part Number Definitions................................................................................. 58
10.2 Valid Part Numbers and Top Side Marking .................................................................. 59
11 HISTORY .................................................................................................................................. 60
ii