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W78LE365_07 Datasheet, PDF (35/42 Pages) Winbond – 8-BIT MICROCONTROLLER
W78LE365/W78L365A
10. PACKAGE DIMENSIONS
10.1 40-pin DIP
D
40
21
E1
1
S
A A2
L
B
e1
B1
10.2 44-pin PLCC
HD
D
6
1 44
7
40
39
20
E
A1 Base Plane
Seating Plane
a
eA
E
HE
GE
17
18
29
28
c
L
θ
Seating Plane
e
b
b1
GD
A2 A
A1
y
Symbol Dimension in incDhimension in m
Min. Nom. Max. Min. Nom. Max.
A
0.210
5.334
A1 0.010
0.254
A2 0.150 0.155 0.160 3.81 3.937 4.064
B 0.016 0.018 0.022 0.406 0.457 0.559
B1 0.048 0.050 0.054 1.219 1.27 1.372
c
0.008 0.010 0.014 0.203 0.254 0.356
D
2.055 2.070
52.20 52.58
E 0.590 0.600 0.610 14.986 15.24 15.494
E1 0.540 0.545 0.550 13.72 13.84 13.97
e1 0.090 0.100 0.110 2.286 2.54 2.794
L
0.120 0.130 0.140 3.048 3.302 3.556
a
0
15 0
15
eA 0.630 0.650 0.670 16.00 16.51 17.01
S
0.090
2.286
Notes:
1. Dimension D Max. & S include mold flash
c
tie bar burrs.
2. Dimension E1 does not include interlead flas
3. Dimension D & E1 include mold mismatch a
are determined at th. e mold parting line
4. Dimension B1 does not include damba
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based
final visual inspection spec.
Dimension in inch Dimension in mm
Symbol Min. Nom. Max. Min. Nom. Max.
A
0.185
4.699
A1 0.020
0.508
A 2 0.145 0.150 0.155 3.683 3.81 3.937
b 1 0.026 0.028 0.032 0.66 0.711 0.813
b
0.016 0.018 0.022 0.406 0.457 0.559
c
0.008 0.010 0.014 0.203 0.254 0.356
D
0.648 0.653 0.658 16.46 16.59 16.71
E
0.648 0.653 0.658 16.46 16.59 16.71
e
0.050 BSC
1.27 BSC
GD 0.590 0.610 0.630 14.99 15.49 16.00
GE 0.590 0.610 0.630 14.99 15.49 16.00
HD 0.680 0.690 0.700 17.27 17.53 17.78
HE 0.680 0.690 0.700 17.27 17.53 17.78
L
0.090 0.100 0.110 2.296 2.54 2.794
y
0.004
0.10
Notes:
1. Dimension D & E do not include interlead
flash.
2. Dimension b1 does not include dambar
protrusion/intrusion.
3. Controlling dimension: Inches
4. General appearance spec. should be based
on final visual inspection spec.
- 35 -
Publication Release Date: January 10, 2007
Revision A7