W29EE512 Datasheet, PDF (20/22 Pages) Winbond – 64K X 8 CMOS FLASH MEMORY

W29EE512
PACKAGE DIMENSIONS
32-pin PLCC
4
5
HE
E
1 32
30
29
D HD
13
14
20
L
θ
Seating Plane
e
b
b1
GE
21
A2
A
A1
y
32-pin TSOP
HD
D
Me
0.10(0.004)
b
θL
L1
GD
c
Symbol
A
A1
A2
b1
b
c
D
E
e
GD
GE
HD
HE
L
y
θ
Dimension In Inches
Min. Nom. Max.
0.140
0.020
0.105 0.110 0.115
0.026 0.028 0.032
0.016 0.018 0.022
0.008 0.010 0.014
0.547 0.550 0.553
0.447 0.450 0.453
0.044 0.050 0.056
0.490 0.510 0.530
0.390 0.410 0.430
0.585 0.590 0.595
0.485 0.490 0.495
0.075 0.090 0.095
0.004
0°
10°
Dimension In mm
Min. Nom. Max.
3.56
0.50
2.67
2.80
2.93
0.66
0.71
0.81
0.41
0.46
0.56
0.20
0.25
0.35
13.89 13.97 14.05
11.35 11.43 11.51
1.12
1.27
1.42
12.45 12.95 13.46
9.91 10.41 10.92
14.86 14.99 15.11
12.32 12.45 12.57
1.91
2.29
2.41
0.10
0°
10°
Notes:
1. Dimensions D & E do not include interlead flash.
2. Dimension b does not include dambar protrusion/intrusion.
3. Controlling dimension: Inches.
4. General appearance spec. should be based on fina visual
inspection sepc.
c
E
A
A2
A1
Y
Symbol
A
A1
Dimension In Inches
Min.
__
0.002
Nom.
__
__
Max.
0.047
0.006
Dimension In mm
Min. Nom.
__ __
__
0.05
Max.
1.20
0.15
A 2 0.037 0.039 0.041 0.95 1.00 1.05
b
0.007 0.008 0.009 0.17 0.20 0.23
c
0.005 0.006 0.007 0.12 0.15 0.17
D
0.720 0.724 0.728 18.30 18.40 18.50
E
0.311 0.315 0.319 7.90 8.00 8.10
H D ^{0.780 0.787} 0.795 ^19.80 20.00 20.20
e
__
__ __
__
0.020
0.50
L
0.016 0.020 0.024 0.40 0.50 0.60
L1
__
__ __
__
0.031
0.80
Y
0.000
__
0.004 0.00
__
0.10
θ
1
3
5
1
3
5
Note:
Controlling dimension: Millimeters
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