W29C020 Datasheet, PDF (20/21 Pages) Winbond – 256K X 8 CMOS FLASH MEMORY

Package Dimensions, continued
32-pin PLCC
4
5
HE
E
1 32
30
29
D HD
13
14
20
L
θ
Seating Plane
e
b
b1
GE
21
A2
A
A1
y
32-pin TSOP
HD
D
Me
0.10(0.004)
b
θ_L
L1
W29C020
GD
c
Symbol
A
A1
A2
b1
b
c
D
E
e
GD
GE
HD
HE
L
y
θ
Dimension in Inches
Min. Nom. Max.
0.140
0.020
0.105
0.110 0.115
0.026
0.028 0.032
0.016
0.018 0.022
0.008
0.010 0.014
0.547
0.550 0.553
0.447
0.450 0.453
0.044
0.050 0.056
0.490
0.510 0.530
0.390
0.410 0.430
0.585
0.590 0.595
0.485
0.490 0.495
0.075
0.090 0.095
0.004
0°
10°
Dimension in mm
Min. Nom. Max.
3.56
0.50
2.67
2.80
2.93
0.66
0.71
0.81
0.41
0.46
0.56
0.20
0.25
0.35
13.89
13.97
14.05
11.35
11.43
11.51
1.12
1.27
1.42
12.45
12.95
13.46
9.91 10.41 10.92
14.86
14.99
15.11
12.32
12.45
12.57
1.91
2.29
2.41
0.10
0°
10°
Notes:
1. Dimensions D & E do not include interlead flash.
2. Dimension b1 does not include dambar protrusion/intrusion.
3. Controlling dimension: Inches.
4. General appearance spec. should be based on final
visual inspection sepc.
c
E
A
A2
A1
Y
Symbol
A
A1
Dimension in Inches
Min.
__
0.002
Nom.
__
__
Max.
0.047
0.006
Dimension in mm
Min. Nom.
__ __
__
0.05
Max.
1.20
0.15
A 2 0.037 0.039 0.041 ^0.95 1.00 1.05
b
0.007 0.008 0.009 0.17 0.20 0.23
c
0.005 0.006 0.007 0.12 0.15 0.17
D
0.720 0.724 0.728 18.30 18.40 18.50
E
0.311 0.315 0.319 7.90 8.00 8.10
H D ^{0.780 0.787 0.795 19.80 20.00 20.20}
__
__ __
__
e
0.020
0.50
L
0.016 0.020 0.024 0.40 0.50 0.60
__
__ __
__
L1
0.031
0.80
__
__
Y
0.000
0.004 0.00
0.10
θ
1
3
5
1
3
5
Note:
Controlling dimension: Millimeters
- 20 -