W29C020 Datasheet, PDF (19/21 Pages) Winbond – 256K X 8 CMOS FLASH MEMORY

W29C020
PACKAGE DIMENSIONS
32-pin P-DIP
32
E1
1
S
A A2
L
D
B
e1
B1
17
16
E
A1 _{Base Plane}
Seating Plane
a
eA
Dimension in inches Dimension in mm
Symbol _{Min. Nom. Max. Min. Nom. Max.}
A
0.210
5.33
A 1 ^0.010
0.25
A 2 ^{0.150 0.155 0.160 3.81 3.94 4.06}
B
0.016 0.018 0.022 0.41 0.46 0.56
B 1 ^{0.048 0.050 0.054 1.22 1.27 1.37}
c
0.008 0.010 0.014 0.20 0.25 0.36
D
1.650 1.660
41.91 42.16
E
0.590 0.600 0.610 14.99 15.24 15.49
E 1 ^{0.545 0.550 0.555 13.84 13.97 14.10}
e 0.090 0.100 0.110 2.29 2.54 2.79
1
L
0.120 0.130 0.140 3.05 3.30 3.56
a
0
15
0
15
eA
0.630 0.650 0.670 16.00 16.51 17.02
S
0.085
2.16
Notes:
1.Dimensions D Max. & S include mold flash or
c
tie bar burrs.
2.Dimension E1 does not include interlead flash.
3.Dimensions D & E1. include mold mismatch and
are determined at the mold parting line.
4.Dimension B1 does not include dambar
protrusion/intrusion.
5.Controlling dimension: Inches.
6.General appearance spec. should be based on
final visual inspection spec.
32-pin SO Wide Body
32
17
E HE
1
b ¹⁶
D
S
y
Seating Plane
A2 A
e
A1
e1
L
Detail F
e1
c
LE
See Detail F
Symbol
A
A1
A2
b
c
D
E
e
HE
L
LE
S
y
θ
Dimension in Inches
Min. Nom. Max.
0.118
Dimension in mm
Min. Nom. Max.
3.00
0.004
0.10
0.101 0.106 0.111 2.57 2.69 2.82
0.014 0.016 0.020 0.36 0.41 0.51
0.006 0.008
0.805
0.012
0.817
0.15
0.20
20.45
0.31
20.75
0.440 0.445
0.044 0.050
0.450
0.056
11.18
1.12
11.30
1.27
11.43
1.42
0.546
0.023
0.556
0.031
0.556
0.039
13.87
0.58
14.12
0.79
14.38
0.99
0.047 0.055 0.063
0.036
1.19
1.40
1.60
0.91
0.004
0.10
0
10
0
10
Notes:
1. Dimensions D Max. & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
3.
Dimensions D & E
and determined at
tihn. eclumdoeldmpoalrdtinmgislimnea.tch
4. Controlling dimension: Inches.
5. General appearance spec should be based
on final visual inspection spec.
- 19 -
Publication Release Date: February 1998
Revision A3