SI8402DB Datasheet, PDF (6/6 Pages) Vishay Siliconix – 20-V N-Channel 1.8-V (G-S) MOSFET

Si8402DB
Vishay Siliconix
PACKAGE OUTLINE
New Product
MICRO FOOT: 4-BUMP (2 X 2, 0.8-mm PITCH)
4 O 0.30 X 0.31
Note 3
Solder Mask O X 0.40
e
e
Recommended Land
A₂
A
A₁
b Diamerter
E
8402
XXX
Mark on Backside of Die
NOTES (Unless Otherwise Specified):
5. Laser mark on the silicon die back, coated with a thin metal.
6. Bumps are Eutectic solder 63/57 Sn/Pb.
7. Non-solder mask defined copper landing pad.
8. The flat side of wafers is oriented at the bottom.
Silicon
Bump Note 2
S
e
e
S
D
www.vishay.com
6
Dim
A
A₁
A₂
b
D
E
e
S
MILLIMETERS*
Min
Max
0.600
0.650
0.260
0.290
0.340
0.360
0.370
0.410
1.520
1.600
1.520
1.600
0.750
0.850
0.370
0.380
INCHES
Min
Max
0.0236
0.0256
0.0102
0.0114
0.0134
0.0142
0.0146
0.0161
0.0598
0.0630
0.0598
0.0630
0.0295
0.0335
0.0146
0.0150
* Use millimeters as the primary measurement.
Document Number: 72657
S-32557—Rev. A, 15-Dec-03